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Optimization of Read and Write Performance of SRAMs for node 5nm and beyond

机译:节点5nm及以外SRAM的读写性能优化

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Scaled technology node SRAMs suffer from increased Bit Line (BL) and Word Line (WL) resistance. To decrease theBL-resistance macro level techniques such as multi-divided array, flying-BL and divided write driver are presented. Todecrease the WL-resistance hierarchical WL and Dual-WL techniques are presented. However, these techniques requirea considerable area overhead. To solve these issues, we present SRAM bit-level BL and WL metallization and optionssuitable for both SADP an EUV. We also present a scaled technology node SRAM macro level PPA estimator to aid insystem level technology benchmark of an SoC with SRAM.
机译:缩放技术节点SRAM患有增加的位线(BL)和字线(WL)电阻。减少提出了BL-电阻宏观技术,如多分割阵列,飞行-B和分开的写驱动器。到减少WL电阻分层WL和双WL技术。但是,这些技术需要相当大的区域开销。要解决这些问题,我们呈现SRAM位级BL和WL金属化和选项适合SADP A euv。我们还提供了一个缩放技术节点SRAM宏级PPA估计器,以帮助SRAM的SOC系统级技术基准。

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