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Research of Method About the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet

机译:高速等离子射流铜涂层沉积在表面上施加方法的研究

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The problem of coupling the heterogeneous materials has always been urgent. There are a lot of ways to solve this problem, but all of them have a number of disadvantages such as high costs, insecurity, etc. The plasma dynamic method is considered as the one of up-to-date solutions. This method allows coupling the heterogeneous materials (for example copper and aluminum, which are the most widely-used material in power engineering), in order to reduce energy losses in the transient contact resistance, by depositing copper on the aluminum contact surface using a coaxial magneto plasma accelerator. In process the accelerator generates a high-speed pulse jet of copper electric erosion plasma, which at high speeds affects the surface of aluminum substrate. A special setup was designed and constructed to determine and calculate the specific transient contact resistance of the obtained contact pairs. The obtained results show the possibility of combining copper and aluminum by depositing a copper coating on aluminum substrate using the plasma dynamic method. The proposed method allows not only coupling copper and aluminum, but also reducing the contact resistance, thereby reducing the energy losses in the transient contacts.
机译:偶联异质材料的问题一直是迫切的。有很多方法可以解决这个问题,但所有这些都有许多缺点,例如高成本,不安全等。等离子体动态方法被认为是最新解决方案之一。该方法允许联接异质材料(例如是电力工程中最广泛使用的铜和铝),以便通过使用同轴在铝接触表面上沉积铜,降低瞬态接触电阻中的能量损失磁性等离子体加速器。在过程中,加速器产生高速脉冲射流的铜电腐蚀等离子体,其高速影响铝基板的表面。设计并构造了特殊设置以确定和计算所获得的接触对的特定瞬态接触电阻。所得结果表明,使用等离子体动态方法将铜涂层沉积在铝基板上,可以将铜和铝结合的可能性。所提出的方法不仅耦合铜和铝,还允许降低接触电阻,从而降低瞬态触点中的能量损失。

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