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Welding behavior of vacuum interrupters equipped with CuCr contact material caused by making and breaking operations under short circuit current interruption

机译:真空中断器的焊接行为,配备CUCR接触材料,通过在短路电流中断下进行操作和破坏操作

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Contact materials based on copper-chromium (CuCr) are widely used in vacuum interrupters for medium voltage applications. Copper-chromium materials with a chromium content between 25 and up to 50 wt.% are selected for the majority of vacuum interrupter applications. For short circuit current making and breaking operations in particular, the material used in the majority of transverse magnetic field (TMF) contact systems worldwide is based on CuCr-25…30 (25 to 30wt.% Cr and 75 to 70wt.% Cu). This study was carried out on standard contact material with a chromium content of 25wt.% and the TMF contact system. A huge number of making, and some breaking, operations under short circuit current conditions were performed on standard vacuum interrupters, as well as materials with micro added elements and chemical compounds to reduce the welding breaking forces. In addition, different contact material production technologies were tested and compared. The tests show that the weld strength decreases according both to the selected production technology, and the composition of the contact material itself. The welding forces, especially after the making operation, were measured by quasi-static tensile test (via slow motion movement of the test set-up), and under dynamic conditions such as the opening operation of the vacuum circuit breaker. Both tests were carried out at ambient temperatures. The statistical effect of the development of the welding force from operation to operation is presented. Characteristics of the fractured surfaces and at the cross section were investigated after a number of making and breaking operations by using a light microscope, scanning electron microscopy (SEM), and energy dispersive X-ray (EDX).
机译:基于铜铬(CUCR)的接触材料广泛用于中压应用的真空中断器。铜 - 铬材料在25至高达50重量%之间的铬含量为大多数真空断续应用。特别是对于短路电流制造和破坏操作,特别是全球大部分横向磁场(TMF)接触系统的材料基于CUCR-25 ... 30(25至30Wt%CR和75至70wt%) 。该研究是在标准接触材料上进行,铬含量为25wt。%和TMF接触系统。在标准真空中断器上进行大量的制造,以及短路电流条件下的操作,以及具有微添加元素和化学化合物的材料,以减少焊接断裂力的材料。此外,测试并比较了不同的接触材料生产技术。该测试表明,焊接强度根据所选择的生产技术和接触材料本身的组成而降低。焊接力,尤其是在制造操作之后,通过准静态拉伸试验(通过测试设置的慢动作运动),并且在诸如真空断路器的开放操作之类的动态条件下进行测量。两个测试都在环境温度下进行。介绍了焊接力的统计效果从操作到操作。通过使用光学显微镜,扫描电子显微镜(SEM)和能量分散X射线(EDX)在许多制作和破坏操作之后,研究了破碎表面和横截面的特性。

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