Preparation of Ultra-Fine Copper Powder and Its Application in Manufacturing Conductive Lines by Printed Electronics Technology

摘要

Ultra-fine copper powder was prepared by ball milling solid phase reaction in ambient condition. Ctystallinity of the synthesized copper powder was investigated using an X-ray diffraction, while the morphology of the copper particles was studied via scanning electron microscopy. The energy dispersive spectroscopy peaks and the analysis of resultant particles' components were also presented. The resultant particles were protected from oxidation by atmospheric air, by the use of benzotriazole. Face-centered cubic copper particles with about 200 nm in diameter were obtained. The resultant powder was impurity-free and shows good stability.