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A 32.9 PAE, 15.3 dBm, 21.6–41.6 GHz power amplifier in 65nm CMOS using coupled resonators

机译:32.9%PAE,15.3 DBM,21.6-41.6 GHz功率放大器在65nm CMOS中,使用耦合谐振器

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This paper presents a wideband millimeter-wave (mm-wave) power amplifier in 65nm CMOS. Coupled resonator based wideband matching technique is used in all the matching network. In the output matching network, the coupled resonator can achieve impedance transformation over a wide frequency range. In the input/inter-stage matching network, the uncoupled resonant frequencies of LC network at two sides of the coupled resonator are shifting towards opposite direction to extend the bandwidth and reduce ripple. The measured PA chip achieves 32.9% peak PAE, 15.3 dBm saturated output power. The fractional bandwidth is 63.3% from 21.6 to 41.6 GHz, which is the widest among reported bulk CMOS mm-wave PAs according to the authors' knowledge.
机译:本文介绍了65nm CMOS中的宽带毫米波(MM波)功率放大器。 基于耦合的基于谐振器的宽带匹配技术在所有匹配网络中使用。 在输出匹配网络中,耦合谐振器可以在宽频范围内实现阻抗变换。 在输入/间级匹配网络中,耦合谐振器两侧的LC网络的未耦合谐振频率朝向相反方向转换以延长带宽并减少纹波。 测量的PA芯片达到32.9%的峰值PAE,15.3dBm饱和输出功率。 分数带宽从21.6到41.6 GHz为63.3%,这是根据作者的知识报告的批量CMOS MM波PAS中最广泛的。

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