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Multi-product lot merging/splitting algorithms for a semiconductor wafer fabrication

机译:半导体晶片制造的多产品批次合并/分裂算法

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This paper focuses on a lot merging/splitting problem in a semiconductor wafer fabrication facility. In the fab, two or more lots can be merged into a single lot if routes and all the processing conditions of the lots are the same for a number of subsequent operations, and the merged lot is split into the original lots at the point where the routes or processing conditions become different. We suggest lot merging/splitting algorithms to reduce the total tardiness of orders and the cycle times of the lots. The suggested algorithms are evaluated through a series of simulation experiments and the result shows that the algorithms work better than a method used in a real fab.
机译:本文侧重于半导体晶片制造设施中的批次合并/分裂问题。在FAB中,如果路由和批次的所有处理条件对于许多后续操作的所有处理条件相同,则可以将两个或更多批次合并为单个批次,并且合并的批次将合并的批次分成原始批次路线或处理条件变得不同。我们建议很多合并/拆分算法,以减少订单的总节目和批次的循环时间。建议的算法通过一系列仿真实验进行评估,结果表明算法优于真实工厂中使用的方法。

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