Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology

摘要

Within the last years, miniaturization has developed rapidly in the areas of mixed-signal and high-frequency technology, driven by mobile communication. Due to the increasing multi-functionality and integration into more complex systems, highest demands are placed on optimum space utilization and the reduction of material and production costs. In particular, the possibilities to use the 3D space efficiently are only insufficiently exploited to date due to the lack of availability of efficient development and manufacturing processes. In addition, high-frequency and fast-paced signals are required to process larger amounts of data in a shorter time. The main difficulty is to ensure a safe signal transmission with low losses and reflections as well as a minimal cross talk between different signal lines even in the case of 3D structures. The use of Molded Interconnect Device (MID) technology provides a suitable basis for meeting the new requirements of such systems. The technology allows circuit design in the third dimension, thus increasing the integration density and improving space utilization. In addition, aspects of the design and connection and assembly technology can contribute to the impedance matching and thus to the RF-suitability of the systems.