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Hydrodynamic characterisation of micro-gaps and microchannels for the thermal control of Photonic Integrated Circuits (PICs)

机译:微间隙和微通道的流体动力学表征光子集成电路热控制(PIS)

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The Thermally Integrated Smart Photonics System project (TIPS) is a European-funded collaboration with an overall objective to develop and demonstrate a scalable, thermally enabled 3D integrated optoelectronic platform that can meet the predicted future explosion in communications data traffic. Global mobile data traffic grew by 74% during 2015 [1], and the current network infrastructure is struggling to sustain traffic increases. With millions of new devices connecting to the network yearly, and high definition video streaming services continuing to dominate internet traffic, contemporary Photonic Integrated Circuits (PICs) have reached a thermal limit, which is impeding large-scale silicon-based system-on-a-chip-integration [2]. Within the overall scope of this project, micro-thermoelectric coolers (μTECs) and micro-fluidics (μFluidics) will be integrated with optoelectronic devices (such as lasers), in order to control device operating temperatures and wavelengths [2]. The aim of such a system is to enable large-scale deployment of highly functional PICs with greater component densities that are cost effective, for communication platforms involving high-bandwidths. The significant outcome of this research will be the realisation of a demonstrator to achieve thermal control of a representative photonic device.
机译:热集成的智能光子系统项目(提示)是欧洲资助的合作,其总体合作,总体目标是开发和展示可扩展的热位的3D集成光电平台,可以满足通信数据流量的预测未来爆炸。 2015年[1]期间,全球移动数据流量增长了74%,目前的网络基础设施正在努力维持流量增加。在数百万的新设备复合到网络,并且高清视频流服务继续支配互联网流量,当代光子集成电路(PICS)已达到热限制,该电流阻碍了大规模基于硅的系统-Chip-Integration [2]。在该项目的总体范围内,微电容冷却器(μTECS)和微流体(μFluidics)将与光电器件(如激光器)集成,以控制器件工作温度和波长[2]。这种系统的目的是能够大规模部署高功能性的照片,具有更大的元件密度,该长度是涉及高带宽的通信平台。该研究的重大结果将实现示威者以实现代表性光子器件的热控制。

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