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Photoresist formulation optimization through the use of statistical design of experimentation

机译:通过使用统计实验设计来优化光刻胶配方

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Abstract: This paper describes the use of statistical design experimentation to improve the photoresist performance properties of Dynachem's Nova 2070. A full factorial design was employed to investigate the effects of changes in the weight percent of both the minor resin and sensitizer in the total solids and of changes in the major resin's molecular weight on the after-hardbake wall profiles. The effect of the formulation changes on lithographic properties such as process latitude and resolution has also been measured. Scanning electron micrographs (SEMs) were generated to measure wall profile, thermal, and lithographic properties. A SEM measurement technique was then developed to quantify resist thermal stability. From these measurements models were generated to show the effects of the various formulation changes and to make predictions with respect to optimum formulations. Graphs of profile tendencies as a function of formulation changes and hardbake temperature and response surfaces generated from the various models are presented to help illustrate the optimization trends. With respect to lithographic performance, the experimental and model data indicate that the optimum resist formulation within the tested experimental matrix has the following make-up: high major resin molecular weight, low minor resin content, and high sensitizer content. With respect to thermal stability, the data suggests that the optimum resist formulation is the following: high major resin molecular weight, high minor resin content, and low to medium sensitizer content. The lithographic property optimum formula was retested to optimize its performance as a function of process changes according to a quadratic statistical design. Comparative process latitude graphs contrasting the optimum formula to alternative formulas under their respective optimized process conditions are also presented. These studies are collectively analyzed to indicate the direction that future resist formulation changes could be made to further optimize resist performance. !10
机译:摘要:本文介绍了使用统计设计实验来改善Dynachem Nova 2070的光致抗蚀剂性能的特性。采用全因子设计来研究次要树脂和敏化剂的重量百分比变化对总固体成分和固体成分的影响。主要树脂的分子量变化对硬烘烤后壁轮廓的影响。还测量了配方变化对光刻特性(如工艺范围和分辨率)的影响。产生扫描电子显微照片(SEM)以测量壁轮廓,热和光刻性能。然后开发了SEM测量技术以量化抗蚀剂的热稳定性。从这些测量中生成模型,以显示各种配方变化的影响并就最佳配方进行预测。呈现了随配方变化以及硬烤温度和由各种模型生成的响应面而变化的轮廓趋势图,以帮助说明优化趋势。关于平版印刷性能,实验和模型数据表明,在测试的实验基质内的最佳抗蚀剂配方具有以下组成:高主树脂分子量,低​​次要树脂含量和高敏化剂含量。关于热稳定性,数据表明最佳的抗蚀剂配方如下:高主要树脂分子量,高次要树脂含量和低至中等敏化剂含量。根据二次统计设计,对光刻性能最佳公式进行了重新测试,以优化其性能作为工艺变化的函数。还显示了比较过程纬度图,这些纬度图将最佳公式与替代公式在其各自的最佳处理条件下进行了对比。对这些研究进行了综合分析,以表明将来可以更改抗蚀剂配方以进一步优化抗蚀剂性能的方向。 !10

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