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Carrier pocket engineering for the design of low dimensional thermoelectrics with high Z{sub}(3D)T

机译:用于设计具有高 Z{sub}(3D)T 的低维热电材料的载流腔工程

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The concept of carrier pocket engineering applied to Si/Ge superlattices is tested experimentally. A set of strain-symmetrized Si(20A)IGe(20A) superlattice samples were grown by MBE and the Seebeck coefficient S, electrical conductivity σ, and Hall coefficient were measured in the temperature range between 4K and 400K for these samples. The experimental results are in good agreement with the carrier pocket engineering model for temperatures below 300K. The thermoelectric figure of merit for the entire superlattice, Z{sub}(3D)T; is estimated from the measured S andσ, and using an estimated value for the thermal conductivity of the superlattice. Based on the measurements of these homogeneously doped samples and on model calculations, including the detailed scattering mechanisms of the samples, projections are made for δ-doped and modulation-doped samples [(001) oriented Si(20A)/Ge(20A) superlattices] to yield Z{sub}(3D)T≈ 0.49 at 300K.
机译:对应用于 Si/Ge 超晶格的载流子袋工程概念进行了实验测试。通过 MBE 生长一组应变对称的 Si(20A)IGe(20A) 超晶格样品,并在 4K 至 400K 的温度范围内测量了这些样品的塞贝克系数 S、电导率σ和霍尔系数。实验结果与温度低于 300K 的载流袋工程模型非常吻合。整个超晶格的热电品质因数 Z{sub}(3D)T;是根据测得的 S 和 σ 估算的,并使用超晶格热导率的估计值。基于这些均匀掺杂样品的测量和模型计算,包括样品的详细散射机制,对δ掺杂和调制掺杂样品 [(001) 定向 Si(20A)/Ge(20A) 超晶格] 进行投影,在 300K 时产生 Z{sub}(3D)T≈ 0.49。

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