Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing

摘要

The thermal conductivity & insulating adhesive was prepared by mixed with diamond particles, epoxy resin (E-20), methanol etherified amino resin, ethylene glycol monobutyl ether (BCS), mixed diethyl ester (DBE), and other additives. The influence on rheological behavior of different particle sizes, volume content of diamond particles was studied. Meantime, the effect of different concentration of dispersant and flatting agent was also investigated. The mechanism of the rheological behavior was analyzed.