Physics-Based Derivation of Design Rules for Vias

摘要

Vias are widely used connections between the different layers of multilayer PCBs. In this paper design rules for signal vias are derived from physics. Analytical formulas for the description of the basic physical effects on a single via are presented. They are used to derive rules for the geometry and the positioning of the via. These design rules are verified using 3d-field simulations.