首页> 外文会议>International Symposium on Materials Science and Engineering;International Conference on Advanced Materials and Engineering Structural Technology >Analysis of Micro Structure and the Resistivity of Cu / Ni Thin Coat as a Low Temperature Sensor Using Electroplating Method Assisted with Magnetic Field Outside of the Ion Flow
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Analysis of Micro Structure and the Resistivity of Cu / Ni Thin Coat as a Low Temperature Sensor Using Electroplating Method Assisted with Magnetic Field Outside of the Ion Flow

机译:使用电镀法在离子流外磁场辅助磁场的低温传感器微结构及Cu / Ni薄涂层的电阻率

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Preservation of materials using liquid nitrogen media has been widely used. One of them is used in the medical field, namely cryonic technology. Cryonics is a method of preservation at cold temperatures using a cryoprotectant in liquid nitrogen. To maintain the quality of the material, a sensor that can detect the temperature of liquid nitrogen is needed. Low temperature sensors with Cu and Ni based Resistance Temperature Detector with layers (RTD) have been made, but these sensors have a layer of Ni deposits that are not yet homogeneous. So quality improvement is needed by adding an external magnetic field. Based on this, the aim of this research is to synthesize a thin layer of Cu / Ni using electroplating method assisted by external magnets parallel to the ion currents. The synthesis was carried out by placing Ni on the anode and Cu on the cathode at a distance of 4 cm, a voltage of 3 V, and a deposition time of 60 s. The electrolyte solution used is a mixture of NiSO4, NiCl2, H3BO3 and H_2O at 60 C. The magnetic field used is 0 G to 250 G at 50 G intervals by placing it parallel to the ion current. The Ni layer that has been formed is then characterized by measuring the thickness of the Ni layer, the microstructure with X-Ray Diffraction (XRD), chip resistivity, and sensor performance.
机译:利用液氮培养基的保护材料已被广泛使用。其中一个用于医疗领域,即冷冻技术。低温是在液氮中使用冷冻保护剂在冷温度下保存的方法。为了保持材料的质量,需要一种可以检测液氮温度的传感器。已经制备了具有Cu和Ni的电阻温度检测器的低温传感器,但是这些传感器具有一层尚未均匀的Ni沉积物。因此,通过添加外部磁场需要质量改进。基于此,本研究的目的是使用通过平行于离子电流的外部磁体辅助的电镀方法来合成Cu / Ni的薄层。通过将Ni放置在阳极上并在阴极上的距离在4cm,电压为3V的距离和60s的沉积时间来进行合成。所用的电解质溶液是NISO4,NiCl2,H3BO 3和H_2O的混合物,在60℃下,通过将平行于离子电流放置,使用的磁场以50g间隔为0g至250g。然后通过测量Ni层的厚度,具有X射线衍射(XRD),芯片电阻率和传感器性能的Ni层的厚度来表征已经形成的Ni层。

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