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Thermal Stability at the Interface between Ferromagnetic Alloys and Germanium for Semiconductor Spintronics Devices

机译:用于半导体纺丝器件的铁磁合金与锗界面的热稳定性

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Spin MOSFET has drawn much attention as an attractive candidate for future semiconductor devices because of its nonvolatility and reconfigurability. For realization of the spin MOSFET, highly efficient spin injection from ferromagnets to semiconductors with low parasitic resistance is one of the most important key technologies. Recently, we demonstrated room-temperature spin transport in germanium (Ge) based lateral spin valve devices with Schottky-tunnel contact, where the interface resistance at the ferromagnet/Ge is much smaller than that with conventional insulating tunnel barriers. However, when the thermal annealing was conducted to fabricate gate-stack structures for the spin MOSFET, the spin injection/detection efficiency was degraded due to the formation of reaction layers at the ferromagnetic alloys/Ge interface. In this study, we explore the enhancement in the thermal stability of the ferromagnet/Ge interface and demonstrate room-temperature spin signals even for the lateral spin device annealed at 250°C by an insertion of five Fe atomic layers between the ferromagnetic alloys and Ge.
机译:由于其非易失性和可重构性,旋转MOSFET作为未来半导体器件的吸引力候选人。为了实现旋转MOSFET,高效的旋转注射来自寄生电阻低的半导体是最重要的关键技术之一。最近,我们展示了具有肖特基隧道触点的锗(GE)的横向旋转阀装置的室温旋转运输,其中铁磁性/电气的界面电阻远小于传统绝缘隧道屏障。然而,当进行热退火以制造用于旋转MOSFET的栅极堆叠结构时,由于铁磁性合金/ GE接口的反应层的形成,旋转注射/检测效率降低。在这项研究中,我们探讨了铁磁性/ GE接口的热稳定性的增强,并且均匀地通过在铁磁合金和GE之间插入50℃的横向旋转装置,即使对于在250℃下退火的横向旋转装置也是如此。

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