Investigation of Solder Bridging Failure for Molded Matrix Array Package

摘要

Solder bridging is a common issue when surface mounting a package to motherboard. Limited studies have been conducted to understand the interaction between mold compound properties and substrate design on package coplanarity and how they relate to bridging. A recent study showed a clear influence of mold compound' properties on localized unit coplanarity within a strip. The paper will also discuss both the modeling study and materials characterization effort on the fixes to prevent bridging.