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Nano-Cleaning of Ge(100) Surface: A STM Study

机译:纳米清洁GE(100)表面:STM研究

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Recently there has been a major quest for new materials with high carrier mobility to substitute for silicon in CMOS semiconductor devices. Since Ge has higher hole and electron mobility compared to silicon, it is a good candidate for development of a new channel material. One of the obstacles in using Ge as a channel material is the high interface trap density between Ge and Ge native oxide. Air exposed Ge surfaces have a high density of defects and contaminants, but, in order to make optimal semiconductor devices, nearly perfect bonding between each unit cell and the gate oxide layer is required. Although there are many methods available for cleaning the Ge surface, the effectiveness of each of these methods highly depends on the cleanliness of the processing chambers. After cleaning, the Ge surface is typically functionalized with OH groups via water (H2O) or hydrogen peroxide (HOOH) during atomic layer deposition of the gate oxide. This OH functionalized surface ideally provides a high density of reactive sites for precursor nucleation. We have studied the effect of a very small amount of hydrocarbon in the processing chambers, and its effect on both the clean Ge surface and the OH functionalized surface since this may increase the density of interface traps and limit Equivalent Oxide Thickness (EOT) scaling. In-situ cleaned Ge surfaces as well as HOOH dosed surfaces have been studied after exposure to hydrocarbon contaminants with x-ray electron spectroscopy (XPS) and scanning tunneling microscopy STM). An Argon ion source sputtering system was employed for in-situ cleaning of the Ge surface. After exposure to trace hydrocarbon contaminants, two different nanoscale features were observed by STM on the Ge and HOOH/Ge surfaces. Figure 1 shows one type of contamination denoted as carbon "nanoclusters". Nanocluster features were observed on the clean Ge surface and were strongly adherent. The Ge surface was exposed to trace hydrocarbon in the load - ock chamber with base pressure of 2x10-8 Torr at 25C and transferred to UHV chamber for sputter cleaning and subsequent annealing at 700°c. The nominally clean Ge surface has 2% coverage of nanoclusters on the surface. The XPS studies confirm that these features are carbon. These carbon nanoclusters are about 0.3-0.5nm in height and 2-4nm in diameter. As shown in Fig 2, a distinctly different feature is observed on the Ge-OH terminated surface denoted as carbon "nanoflakes". In contrast to nanoclusters, nanoflakes were only observed on the Ge surfaces dosed with hydrogen peroxide. To form the Ge-OH terminated surface, clean Ge was dosed with the vapor from 30% HOOH/H2O for 45 sec at 25C in the load lock with a base pressure of 2x10-8 Torr. There is about 6% coverage of nanoflakes on the hydrogen peroxide dosed Ge surface. These nanoflakes are about 0.3- 0.5 nm in height and 2- 4nm in diameter. There are two possible mechanism of nanocluster and nanoflake formation [1, 2]: (a) deposition of nanoparticles from the gas phase or (b) sticking of hydrocarbon molecules from the gas phase and particle formation on the surfaces. The distinct size distribution of the particles on the clean Ge(100) vs HOOH/Ge(100) is most consistent with the carbon nanoclusters and nanoflakes forming via molecular hydrocarbon deposition with subsequent particle formation on the surface. The results show the need for fast ALD reactions to insure that after in-situ cleaning and Ge-OH functionalization, the surface is only briefly exposed to background hydrocarbon.
机译:最近,对于具有高载流动性的新材料,替代CMOS半导体器件中的硅的新材料。由于GE与硅具有更高的孔和电子迁移率,因此是一种用于开发新的通道材料的良好候选者。使用GE作为沟道材料的障碍物是GE和GE天然氧化物之间的高界面陷阱密度。空气暴露的Ge表面具有高密度的缺陷和污染物,但是为了使最佳半导体器件进行最佳的半导体器件,所以需要几乎完美的键合和栅极氧化物层。尽管有许多可用于清洁GE表面的方法,但这些方法的有效性高度取决于处理室的清洁度。清洁后,Ge表面通常通过水(H2O)或过氧化氢(HOOH)在栅极氧化物的原子层沉积期间用OH基团官能化。该OH官能化表面理想地提供高密度的前体成核的活性位点。我们已经研究了加工腔室中非常少量的烃的效果,其对清洁Ge表面和OH官能化表面的影响,因为这可以增加界面陷阱的密度和极限等效的氧化物厚度(EOT)缩放。在接触到碳氢化合物污染物和扫描隧道显微镜STM后,已经研究了原位清洁的GE表面以及HOOH剂量表面。用于原位清洁Ge表面的氩离子源溅射系统。暴露于痕量烃污染物后,通过GE和HOOH / GE表面上的STM观察到两种不同的纳米级特征。图1显示了作为碳&#x0022的一种类型的污染物;纳米能器"在清洁GE表面上观察到纳米光幕特征,强烈粘附。将Ge表面暴露于载荷室中的痕量烃,在25℃下具有2×10-8托的基础压力,并转移到UHV室以进行溅射清洁和随后在700&#000b0的退火。c。名义上清洁的GE表面在表面上具有2%的纳米蛋白覆盖率。 XPS研究确认这些功能是碳。这些碳纳米蛋白的高度约为0.3-0.5nm,直径为2-4nm。如图2所示,在GE-OH终止表面上观察到明显不同的特征,其表示为碳"纳米薄片"与纳米能器相比,仅在用过氧化氢的Ge表面上观察到纳米薄片。为了形成Ge-OH终止表面,在载荷锁定的25℃下,用30%HOOH / H 2 O的蒸汽在载荷锁定为2×10〜8托的载荷锁定的蒸汽时,用蒸汽给予蒸汽。在过氧化氢含量Ge表面上大约有6%的纳米薄片覆盖。这些纳米薄片的高度约为0.3-0.5nm,直径为2-4nm。存在两种可能的纳米簇和纳米片形成的机制[1,2]:(a)从气相或(b)从气相中粘附来自气相的烃分子和表面上的颗粒形成。在清洁Ge(100)Vs hooh / ge(100)上的颗粒的不同尺寸分布与通过分子烃沉积形成的碳纳米能器和纳米薄片与表面上的后续颗粒形成。结果表明,需要快速ALD反应,以确保在原位清洗和GE-OH官能化之后,表面仅短暂地暴露于背景烃。

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