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Tuning the Germanium TFET: Device Optimization for Maximum Ion

机译:调整锗TFET:最大离子的装置优化

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As MOSFET scaling has attained the 22 nm node, alternative concepts are intensively being investigated. The concept of the Tunneling Field Effect Transistor (TFET) is currently being explored as one of the device concepts most likely to enable energy efficient computation that, in addition, can potentially outperform the conventional MOSFET. We present a vertical device architecture grown with a solid source SiGe Molecular Beam Epitaxy (MBE) technique. The layer structure consists of a p+-i-n+ heterostructure. Layer growth by MBE enables us to realize abrupt heterojunctions and sharp doping profiles, which are key requirements for high TFET performance. For the Ge vTFET we used a special low temperature processing. With the improved growth of the TFET structure, we can achieve a high record Ion of 822 μA/μm at p-channel operation. This represents a considerable improvement over previous Ge (v)TFET devices. The Ion/Ioff ratio approaches three decades in p-channel mode.
机译:由于MOSFET缩放达到了22个NM节点,因此正在研究替代概念。 目前正在探索隧道场效应晶体管(TFET)的概念,因为最有可能使能节能计算的设备概念之一,此外,还可以潜在优于传统的MOSFET。 我们介绍了一种具有固体SiGe Sige分子束外延(MBE)技术的垂直装置架构。 层结构由p + -i-n +异质结构组成。 MBE的层增长使我们能够实现突然的杂交和尖锐的掺杂曲线,这是高TFET性能的关键要求。 对于GE VTFET,我们使用了特殊的低温处理。 随着TFET结构的增长改善,我们可以在P沟道操作下实现822μA/μm的高记录离子。 这代表了对以前的GE(V)TFET设备的相当大改进。 离子/夹型比率在P沟道模式下接近三十年。

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