Preparation of polymer-metal nanocomposite films and performance evaluation as thermal interface material

摘要

An urgent need for improved thermal management of microelectronic systems has emerged as a direct consequence of increasing integration densities, both at chip and packaging level. Current thermal interface materials have been identified as a major bottleneck, hindering reduction of junction to ambient thermal resistance to future required levels (≪ 0.2 KW−1). In this paper we introduce and characterize the thermal performance of a nanostructured polymer-metal composite aimed at thermal interface material applications. The composite consists of a high porosity polymer nanofiber network infiltrated with a low melting temperature alloy. The inherent structure of the composite provides all-metal high thermally conductive pathways from surface to surface in assemblies. Results indicate total thermal resistances as low 8.5 Kmm2W−1 at bondline thicknesses of approximately 70 μm, corresponding to an effective thermal conductivity of up to 8 Wm−1K−1.