Ceramic thick film technology has proven over the years to be a very reliable technology yielding electronic circuits with excellent performance, suitable for even the most demanding environments. In today's electronics functional integration and system miniaturisation are key issues in hardware design and implementation. It is obvious that in order to address these needs every interconnection technology is evolving towards higher integration densities. In thick film technology recent developments have proven the capability to provide higher interconnection densities by means of combining the photolithography with standard thick film processes. Initially, these innovative material systems were based on gold as a conductor material addressing primarily high performance applications. The replacement of gold by silver bearing conductors in complement with a reliable high performance dielectric would allow to form a multilayer interconnection technology with a comparable performance, but with a very important cost reduction.
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