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Femtosecond laser micromachining of SiC ceramic structures

机译:SIC陶瓷结构的飞秒激光微机械

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Femtosecond laser micromachining technology shows abroad application background in the field of micro manufacturing due to its unique advantages, especially for micromachining of ultrahard materials such as Silicon carbide (SiC) ceramic. The femtosecond laser micromachining system was set up, by using the system, effects of scanning velocity and laser pulse energy on quality of micromachined features were evaluated. The optimized technological parameter was obtained as 8mW, 1mm/s with 1kHz repetition frequency respectively on the basis of the morphological characteristics and microstructure accuracy. Besides, V-shaped cavity of 300μm depth and 120°angle was generated with layer-by-layer scan machining. Thus femtosecond laser micromachining technology is an effective method for hard and brittle materials precision processing.
机译:FemtoSecond激光微机械线技术在微型制造领域出现了国外应用背景,由于其独特的优势,特别是对于碳化硅(SiC)陶瓷等超级材料的微机械线。 通过使用该系统建立了飞秒激光微加工系统,评估了扫描速度和激光脉冲能量对微机械型特征质量的影响。 优化的技术参数以8MW,1kHz重复频率获得1kHz的重复频率,基于形态学特性和微观结构精度。 此外,通过层逐层扫描加工产生300μm深度和120°角的V形腔。 因此,Femtosecond激光微加工技术是一种用于硬质和脆性材料精密加工的有效方法。

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