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Novel post-process gap reduction technology of high aspect ratio microstructures ultilizing micro welding

机译:高纵横比微观结构的新型工艺间隙减少技术utilized微焊接

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This paper presents a novel post-process gap reduction technology of high aspect ratio microstructures. The gap reduction procedure uses the well known electrostatic deflection of a movable microstructure. In contrast to other solutions, micro welding is utilized to create the final, permanent locking. The fabrication technology, the functional principle of the gap reduction mechanism and the experimental set-up is presented. As a result the initial gap width between vertical comb electrodes was decreased from 4500 nm to 385 nm, leading to a final aspect ratio of 150.
机译:本文提出了一种新的高纵横比微观结构的过程后差距减少技术。 间隙还原过程使用可移动微结构的众所周知的静电偏转。 与其他解决方案相比,利用微焊接来产生最终永久锁定。 制造技术,介绍了间隙减少机构的功能原理和实验组。 结果,垂直梳状电极之间的初始间隙宽度从4500nm到385nm降低,导致最终纵横比为150。

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