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BASE MATERIALS FOR LOW POWER CONTACT APPLICATIONS PREPARED BY MAGNETRON SPUTTERING

机译:磁控溅射制备的低功率接触应用的基础材料

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Surface improvements by means of magnetron sputtering for low-voltage engineering were deposited and investigated as to their suitability for a contact material. The result showed that the tin alloy SnTiAl, i-C/metal composites and microlaminates as a class of material proved to be especially suitable alternative contact materials.
机译:通过磁控溅射进行表面改进,沉积并研究了它们对接触材料的适用性。 结果表明,锡合金SNTIAL,I-C /金属复合材料和微凝胶作为一类材料被证明是特别合适的替代接触材料。

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