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Improve the Shipping Performance of Build-to-Order (BTO) Product in Semiconductor Wafer Manufacturing

机译:改进半导体晶片制造中的秩序(BTO)产品的运输性能

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The aim of this paper is to establish an application to review and control the shipping performance of build-to-order (BTO) product in semiconductor wafer manufacturing. The final goals are to avoid shortage of each order released from wafer bank to fulfill the finished goods requirement and minimize the overage quantity that will induce the high inventory. We apply the statistical method in wafer sort yield prediction via history data. Base on this, we can model The overage and shortage quantity with the influential variables, namely order size, yield variability, uncertain demand and customer acceptance criterion. The model also allows estimating the expected overage as the review criterion between manufacturing unit and sales unit.
机译:本文的目的是建立一个申请,以审查和控制半导体晶片制造中的按订单(BTO)产品的运输性能。 最终目标是避免从晶圆银行释放的每个订单的短缺,以满足成品的需求,并最大限度地减少将诱导高库存的过剩量。 我们通过历史数据应用晶片排序产量预测的统计方法。 基于此基础,我们可以使用有影响力的变量模拟超额和短缺数量,即订购规模,屈服可变性,不确定需求和客户验收标准。 该模型还允许将预期的超额估算作为制造单元和销售单元之间的审查标准。

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