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Analytical and computational modeling of viscothermal acoustic damping in perforated microstructures

机译:穿孔微观结构中助力学声阻尼的分析与计算建模

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Predicting the viscothermal acoustic behavior of microstructures is crucial in the design of micro-electro-mechanical systems (MEMS). In MEMS structures the dimensionless shear wave-number is typically smaller than one. Therefore, the viscous effects are larger than inertial effects and are the dominant part of the impedance. In this work, an analytical solution for the viscothermal acoustic impedance for perforated microstructures used in MEMS devices is developed based on the low reduced-frequency (LRF) method. This solution is based on a full-plate approach, as opposed to the single-cell approach, which includes all viscous and thermal losses as well as compressibility and inertial effects. Additionally, a 3D viscothermal acoustic model using the finite element method (FEM) is developed to solve the problem numerically for the case of a MEMS microphone. The results of the analytical LRF solution are in good agreement with the FEM results. The results can be applied in designing MEMS devices to minimize the damping and to optimize the acoustic performance of the MEMS devices.
机译:预测微观结构的含量声学行为对于微机电系统(MEMS)的设计至关重要。在MEMS结构中,无量纲剪切波数通常小于1。因此,粘性效应大于惯性效应,是阻抗的主要部分。在这项工作中,基于低减速频率(LRF)方法,开发了MEMS器件中使用的穿孔微结构的辅助声学阻抗的分析解决方案。该解决方案基于全板方法,而不是单细胞方法,包括所有粘性和热损失以及压缩性和惯性效果。另外,使用有限元方法(FEM)的3D助听声学模型开发用于在数值上解决MEMS麦克风的情况。分析LRF解决方案的结果与FEM结果吻合良好。结果可以应用于设计MEMS器件以最小化阻尼并优化MEMS器件的声学性能。

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