Analytical and numerical modeling of squeeze-film damping in perforated microstructures

摘要

The literature in variety of analytical and semi-analytical models to describe squeeze-film damping in MEMS perforated structures. Even if many of them have been validated by means of numerical simulations, nobody seems to have discussed about the accuracy of numerical approaches in this field. In the present paper, we apply both the main analytical models and a commercial finite element software, COMSOL Multiphysics, to solve a good number of squeeze-film problems. They refer to some cases, which were experimentally investigated during the past by different authors. The tested structures are rigid rectangular plates fabricated with different material, different perforation ratio (i.e., the ratio of the hole side to the holes pitch) and different number of perforations. We compare both the analytical and the numerical results with the available experimental data, in order to have an overview about their effectiveness. Numerical simulations offer in all the considered cases valuable agreement with experiments.