Thermal Shock Testing of Ceramics for Circuit Substrates

摘要

Thermal shock resistances of commercially available aluminum nitride and alumina ceramics as used for the circuit substrate were evaluated by infrared radiation heating (IRH) technique. Thermal shock fracture toughness, R_(2c) of these materials was estimated experimentally and theoretically using IRH technique at various ambient temperatures. Temperature dependence of thermal properties of the materials was taken into account for the temperature and the thermal stress analysis. Experimental values of thermal shock fracture toughness were in good agreement with the calculated values. Thermal shock fracture toughness decreased with elevated ambient temperature in both ceramics.