Thermal-electrical Coupled Simulation Analysis of Sealed Electromagnetic Relays

摘要

The heat generated during the working process of the relay directly affects the mechanical strength of the metal material and the dielectric strength of the insulating material. Sealed electromagnetic relays tend to be miniaturized. The effect of temperature on its working life is getting stronger. Therefore, it is very important to analyze the thermal characteristics of the main components inside the relay. The mathematical model of the thermal field is established by analyzing the heat transfer mode of the sealed electromagnetic relay and the boundary conditions of each component. The finite element model of the relay is established by the ideal equivalent method. This model has higher computational efficiency and accuracy than traditional computational models when performing thermal analysis. The temperature field of this model is studied by thermoelectric coupling method. The effects of ambient temperature and current intensity on the steady-state temperature field and transient temperature field of the sealed electromagnetic relay are discuss separately. The simulation results show that the ambient temperature is independent of the temperature distribution inside the relay and the current intensity will affect the main heat source type inside the relay. The research method of this paper can provide technical support for thermal characteristic analysis in the design stage of sealed electromagnetic relay.