FLUX RESIDUES UNDER COMPONENTS - ARE THEY BAD?

摘要

The electronics industry spent decade's religiously cleaning printed circuit assemblies and rigidly controlling the type of flux used in the creation of solder joints due to concerns of corrosion induced failures. The implementation of the Montreal Protocol in 1989 initiated an industry evolutionary step by creating an opportunity for the introduction of low residue flux materials, new cleaning chemistries and no clean soldering processes. New materials and processes are not without their challenges but the electronics industry found their stride settling into a set of mature flux chemistries and soldering processes.