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Breakdown Voltage Assessment of GaN HEMT Devices through Physics-Based Modeling

机译:通过基于物理建模的GaN HEMT器件的击穿电压评估

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An extensive study is conducted to evaluate breakdown mechanisms in gallium nitride (GaN) high electron mobility transistors (HEMT). A comprehensive physics-based model of a common HEMT provides the base comparison to conduct different material and geometric investigations. The variations are evaluated in a progression toward the optimal configuration: 1) varying the passivation material, 2) replacing the substrate material, 3) reducing the doping profile along the GaN and aluminum nitride (AlGaN) layers and 4) a field plate (FP) addition. The electric field distribution across the source, gate, and drain is analyzed for each case as well as their I-V curves until the breakdown voltage (BV). The best results are revealed under the FP case.
机译:进行广泛的研究以评估氮化镓(GaN)高电子迁移率晶体管(HEMT)中的击穿机制。 基于普通HEMT的综合物理学模型提供了对不同材料和几何研究的基础比较。 在最佳配置的进展中评价变化:1)改变钝化材料,2)更换基板材料,3)沿GaN和氮化铝(AlGaN)层和4)减少掺杂曲线和4)磁场板(FP ) 添加。 为每种情况以及它们的I-V曲线分析源极,栅极和漏极的电场分布,直到击穿电压(BV)。 在FP案例下揭示了最佳结果。

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