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Disassembly sequencing for end-of-life products

机译:拆卸寿命终端产品

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摘要

When a product reaches its end of lifecycle, its components can be reused, recycled or disposed depending on their conditions and recovery value. All these strategies involve the disassembly of products. A method for generation of disassembly sequences is proposed in this paper. It is based on hierarchical analysis of the modules constituting the product. The method uses informations such as: list of subsets (modules), liaison-component graph, part geometry, functional contacts between components and modules, component properties (density, surface treatment,) all contained in a database. It has been tested on several products disassembly. The application of the method is explained with an example.
机译:当产品达到生命周期结束时,其组件可以根据其条件和恢复值重用,再循环或设置。所有这些策略都涉及产品的拆卸。本文提出了一种用于产生拆卸序列的方法。它基于构成产品的模块的分层分析。该方法使用诸如:子集(模块)列表列表(模块),联络组件图,部分几何,组件和模块之间的功能触点,组件属性(密度,表面处理),组件属性(密度,表面处理),包括在数据库中。它已在几种拆卸产品上进行了测试。用示例解释该方法的应用。

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