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Fabrication and Characteristics of Energetic Igniters Realized Through Sputtered Tantalum Nitride(TaN) Film Bridge

机译:通过溅射钽膜(棕褐色)薄膜桥实现的高能点火器的制造和特征

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This paper introduces energetic igniters fabricated using TaN film bridge by magnetron sputtering. It is inferred from the image of wet-etched TaN film bridge that film edge is clearly visible and relatively smooth with lateral erosion size of 5μm. The X-ray diffraction (XRD) and Temperature Coefficient of Resistance (TCR) results show that the crystalline of TaN films has great influence on the TCR values by changing the N_2 partial pressure. The TaN films in this paper exhibit a near zero TCR value of approximately 10 ppm/°C. The electrical explosion characteristics employing a capacitor discharge firing set at the optimized charging voltage of 45V reveal that an excellent explosion phenomenon of TaN film bridge is observed with small ignition delay time, high explosion temperature, much more bright flash of light and much large quantities of the ejected product particles. The peak explosive temperature of TaN film bridge at various dimensions is ranging from 3500K to 5700K, which is almost as same as that of the semiconductor bridge.
机译:本文通过磁控溅射介绍了使用TAN薄膜桥制造的能量点火器。从湿法蚀刻的棕褐色薄膜桥的图像推断,薄膜边缘清晰可见,横向腐蚀尺寸为5μm。 X射线衍射(XRD)和温度抗性系数(TCR)结果表明,通过改变N_2分压,TAN薄膜的结晶对TCR值具有很大影响。本文中的TAN薄膜具有约10ppm /°C的接近零TCR值。采用电容器放电烧制的电气爆炸特性在45V的优化充电电压下显示,具有小点火延迟时间,高爆炸温度,光闪光闪光闪光闪光闪光闪光和大量闪光的优异爆炸现象显示出了棕褐色薄膜桥的出色爆炸现象。喷射产品颗粒。各种尺寸的Tan薄膜桥的峰值爆炸温度范围为3500K至5700K,与半导体桥的TANG到5700K。

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