Properties of SnAgCu Solders Bearing Al Nanoparticles

摘要

In order to enhance the properties of SnAgCu lead-free solders, the Al nanoparticles was selected as the additives. The effects of Al nanoparticles on wettability and mechanical properties of solder and solder joints were studied. The results showed that a small amount of Al can enhance the wettability of SnAgCu solders. With the N_2 atmosphere, the wettability of SnAgCu-xAl can be increased obviously, which can be attributed to the N_2 can resist the oxidation of molten solder. Combing different fluxes, the wettability of lead-free solder can represent variation, the suitable flux can improve the wettability of SnAgCu-xAl solders. Moreover, the mechanical property of solders can be improved obviously with the addition of Al nanoparticles.