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3D integration of control electronic for mobile minimachine

机译:控制电子对控制电子的3D集成

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Many research centers over the world solved problems with mobile robots for rough terrain and for human inaccessible places. There are more advantages of described solution. Miniature robot is able to work in constrained compartments and with installed camera system provide inspection of surrounding environment. Added value is possibility of chassis replacement to optimal and fast replacement of contact elements (whegs, wheel, belts). 3D integration of control electronic was based on heterostructure LTCC structure-HTCC substrate with shaped part for sensor placement. The proposed method of heterostructure creation consists of the following steps-planar lamination of LTCC structure, in the case of shaped LTCC structure its lamination in shaping preparation and burning of LTCC structure placed on HTCC substrate. During lamination process is important parameter surface quality of shaping preparation, considering that in the lamination process copying of all inequalities of the surface occurs. Technological solution has been applied during the 3D integrations of mobile mini-machine control electronics in a System on Module (SoM) assembly.
机译:许多研究中心在世界上解决了移动机器人的问题,用于崎岖的地形和人类无法进入的地方。描述的解决方案有更多的优点。微型机器人能够在约束隔间工作,并安装相机系统提供周围环境的检查。附加值是底盘更换到最佳和快速更换接触元件(Whegs,Wheel,皮带)的可能性。控制电子的3D集成基于异质结构LTCC结构 - HTCC衬底,其成形部分用于传感器放置。异质结构创建所提出的方法包括LTCC结构的以下步骤平面层压的,在成形的结构LTCC其在成形制备和LTCC结构放置HTCC基片上的层压燃烧的情况下。在层压过程中,塑造准备的重要参数表面质量,考虑到在层压过程中,拷贝的所有不等式发生。在模块(SOM)组装系统中的移动迷你机控制电子设备的3D集成期间应用了技术解决方案。

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