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Simulation of Quantum Dot Floating Gate MOSFET Memory Performance using Various High-K Material as Tunnel Oxide

机译:用各种高k材料作为隧道氧化物的量子点浮栅MOSFET存储器性能模拟

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In this paper, performance of quantum dot floating gate MOSFET memory is simulated by replacing the SiO_2 tunnel oxide with high-κ material. There are three high-k material simulated in this paper, HfO_2, ZrO_2, and Y_2O_3. As we know that high-κ material is used nowadays to reduce leakage current, so this paper demonstrates the application of high-κ material to reduce leakage current in non-volatile memory quantum dot based floating gate MOSFET. Simulation results of this paper show the leakage current can be suppressed by using high-κ material as tunnel oxide up to 10 times. Furthermore, this paper also shows that the memory performance can be properly sustained. The writing and erasing time are depend on tunneling current probability which calculated using transfer matrix method. The writing time and erasing time for HfO_2 and ZrO_2 are 150 nanosecond and 15 nanosecond.
机译:在本文中,通过用高κ材料代替SiO_2隧道氧化物来模拟量子点浮栅MOSFET存储器的性能。本文中有三种高k材料,HFO_2,ZrO_2和Y_2O_3。如我们所知,现在使用高κ材料以减少漏电流,因此本文演示了高κ材料在基于非易失性存储器量子点浮栅MOSFET中的漏电流降低漏电流。仿真结果表明,通过使用高达10次的隧道氧化物,可以通过使用高κ材料来抑制漏电流。此外,本文还表明,存储性能可以正确持续。写入和擦除时间取决于使用传输矩阵方法计算的隧道电流概率。 HFO_2和ZrO_2的写入时间和擦除时间为150纳秒和15纳秒。

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