Study on Thermal Assisted Direct Bonding of Glasses for Lab-On-Chip Application through Surface Activation Process

机译：通过表面激活过程研究玻璃玻璃对芯片施用的热辅助直接粘合

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Surface treatment before glass bonding is an important and critical issue for glass-based lab-on-chip fabrication. In the present article we verified five different activation methods for obtaining sound thermal assisted direct bonding (TADB) on glasses. Glass surface has been investigated by means of water contact angle, X-ray photoelectron spectroscopy (XPS). The optimum surface activation method for TADB on glasses was found to be H_2SO_4:H_2O_2 (3:1 by volume) followed by HNO_3. By using the TADB optimized activation method, the glass bonding strength higher than 32MPa was obtained with a glass the roughness of 50 nm.

机译：玻璃粘合前的表面处理是基于玻璃的实验室制造的重要且批判性问题。在本文中，我们验证了五种不同的激活方法，以获得玻璃上的声热辅助直接粘合（TADB）。通过水接触角，X射线光电子体光谱（XPS）研究了玻璃表面。发现玻璃上的TADB的最佳表面活化方法是H_2SO_4：H_2O_2（3：1体积），然后是HNO_3。通过使用TADB优化的活化方法，获得高于32MPa的玻璃粘合强度，玻璃粗糙度为50nm。

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《International Conference on Materials Science and Computing Science》|2011年||共6页
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Qiuling Chen; Qiuping Chen; Monica Ferraris;
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原文格式 PDF
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中图分类 978-3-03795-064-7;
关键词
Surface activation; Glass direct bonding; Lab-on-chip; Bonding strength;

机译：表面活化;玻璃直接粘合;芯片芯片;粘合强度;

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1. Thermal assisted direct bonding between structured glasses for lab-on-chip technology [J] . Qiuping Chen, Qiuling Chen, Daniel Milanese, Microsystem Technologies . 2009,第12期

机译：用于芯片实验室技术的结构化玻璃之间的热辅助直接粘合
2. Optimization of thermal assisted direct bonding of soda-lime glasses for lab-on chip application [J] . Qiuping Chen, Qiuling Chen, Monica Ferraris Microsystem Technologies . 2010,第4期

机译：用于实验室芯片应用的钠钙玻璃热辅助直接粘合的优化
3. Optimization of thermal assisted direct bonding of soda-lime glasses for lab-on chip application [J] . Qiuping Chen, Qiuling Chen, Monica Ferraris Microsystem Technologies . 2010,第4期

机译：用于实验室芯片应用的钠钙玻璃热辅助直接粘合的优化
4. Study on Thermal Assisted Direct Bonding of Glasses for Lab-On-Chip Application through Surface Activation Process [C] . Qiuling Chen, Qiuping Chen, Monica Ferraris International Conference on Materials Science and Computing Science . 2011

机译：通过表面活化工艺进行玻璃玻璃热辅助直接粘接的研究
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Study on Thermal Assisted Direct Bonding of Glasses for Lab-On-Chip Application through Surface Activation Process

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