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Advanced DFT Features for an Industrial Application SoC

机译:工业应用SoC的高级DFT功能

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With the development of process technologies and increased complexity of chips, SoC (System-on-Chip) testing becomes more and more difficult. Traditional testing methods cannot meet the current design requirements anymore. In this paper, we present a DFT (design-for-testability) scheme for an industrial application SoC chip basing on SMIC 130nm CMOS technology, it includes boundary scan test, memory BIST (built-in self-test), at-speed scan testing and parameter testing. Experimental results demonstrate that the proposed technique can gain high fault coverage and test compression ratio, which are 97.39% and 30%, satisfying the project demands.
机译:随着工艺技术的发展和芯片的复杂性增加,SoC(片上系统)测试变得越来越困难。传统的测试方法不再符合当前的设计要求。在本文中,我们为SMIC 130NM CMOS技术的工业应用SOC芯片提供了一种DFT(型材设计)方案,它包括边界扫描测试,存储器BIST(内置自检),速度扫描测试和参数测试。实验结果表明,所提出的技术可以获得高故障覆盖和测试压缩比,符合项目需求的97.39%和30%。

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