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Hydration Effect Analysis of Ion-Sensitive Field Effect Transistor

机译:离子敏感场效应晶体管的水化效果分析

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In this work, the drift of ISFET characteristics due to the hydration effect was studied. The ISFETs were fabricated using the standard NMOS process and the AgCl reference electrode was fabricated with the electrolysis method. The ISFET modeling was carried out in MATLAB to study the time variation of surface potential and the drain-source current. In addition, the surface morphology and dielectric constant of silicon dioxide were measured to study the hydration effect. It was found that the dielectric constant of the gate oxide increases exponentially with hydration time. The surface morphology studied with the atomic force microscope (AFM) showed no significant change after immersion in water. It is believed that the main cause of the drift is the hydration effect, which is due to the change in dielectric constant of the sensing material and a small number of surface binding sites that react slowly to a change in pH.
机译:在这项工作中,研究了由于水化效果引起的ISFET特性的漂移。使用标准NMOS工艺制造ISFET,并用电解方法制造AGCL参比电极。 ISFET建模在Matlab中进行,以研究表面电位的时间变化和漏极源电流。另外,测量了二氧化硅的表面形态和介电常数,以研究水合效果。发现栅极氧化物的介电常数随水合时间呈指数呈指数增长。用原子力显微镜(AFM)研究的表面形态显示浸入水中后没有显着变化。据信,漂移的主要原因是水合效果,这是由于感测材料的介电常数和少量表面结合位点的变化,其在pH的变化中缓慢反应。

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