THERMAL PERFORMANCE OF PACKAGES USED FOR A 'XAUI' HIGH SPEED INTERFACE

摘要

The increased need for higher speed and power levels has required the transition from a standard plastic ball grid array (PBGA) package to an enhanced plastic ball grid array (EBGA) package for several applications. An example of this is the variety of devices being developed for "Xaui" communication applications. To compensate for the increased power dissipation several changes to the standard PBGA design have been implemented. Once this avenue was exhausted, numerous drop in type spreaders were patented. However, these spreaders only increase the thermal performance of the package by 9-18%. More recently, build-up cavity down EBGA type packages containing a back spreader, have become the package of choice both electrically and thermally. The thermal characteristics of these packages are discussed and a power dissipation use range for each package is identified in this paper.