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Thermal interface material design for enhanced thermal performance and improved package structural integrity
Thermal interface material design for enhanced thermal performance and improved package structural integrity
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机译:热界面材料设计可增强热性能并改善封装结构完整性
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摘要
An electronic package 100 comprising a semiconductor device 105, a heat spreader layer 110, and a thermal interface material layer 115 located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer 120 having heat conductive particles 125 suspended therein. A portion of the particles are exposed on at least one non-planar surface 135 of the resin layer such that the portion of exposed particles 130 occupies a majority of a total area of a horizontal plane 140 of the non-planar surface.
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