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Advanced Micromorphology Analysis of Cu/Fe NPs Thin Films

机译:Cu / Fe NPS薄膜的先进微晶分析

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In this work,an advanced analysis of Cu/Fe NPs thin films using atomic force microscopy(AFM)has been discussed to characterize at nanoscale 3-D surface microtexture.Samples of Cu/Fe thin films were fabricated by Direct Current-Magnetron Sputtering technique with two controlled thicknesses(group I:Cu 55 nm/Fe 55 nm and group II:Cu 55 nm/Fe 70 nm)in specific conditions of pressure and power.The results obtained from experimental measurements suggested that the surface of group I has the lowest values for fractal dimension(D = 2.28 ± 0.01)and root mean square height(Sq = 4.40 ± 0.1 nm);while the highest values for fractal dimension(D = 2.31 ± 0.01)and root mean square height(Sq = 4.67 ±0.1 nm)were found in group II.Stereometric and fractal analyses applied for thin films are modern tools for accurate quantitative morphometric characterisation.
机译:在这项工作中,已经讨论了使用原子力显微镜(AFM)的Cu / Fe NPS薄膜的高级分析,以表征在纳米级3-D表面微织物中。通过直流 - 磁控溅射技术制造Cu / Fe薄膜的叠层在特定的压力和功率条件下,具有两个受控厚度(第I族:Cu 55nm / Fe 55nm和第II族:Cu 55nm / Fe 70nm)。从实验测量中获得的结果表明,我的表面分形尺寸的最低值(d = 2.28±0.01)和均方根高度(Sq = 4.40±0.1nm);而分形尺寸的最高值(d = 2.31±0.01)和均方根高度(Sq = 4.67±在第II组中发现了0.1nm。施加用于薄膜的经历和分形分析是用于准确定量的形态学表征的现代工具。

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