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Internal structure of metal material with gas permeability function related to MEMS devices

机译:金属材料的内部结构与MEMS器件有关的气体渗透功能

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MEMS technology is incorporated into various devices (automobiles, digital cameras, optical devices) indispensable for our daily lives. Semiconductor manufacturing process technology such as photolithography method and ion beam method is mainly used for micropatterning necessary for MEMS and microfabrication of diffraction grating. In photolithography, many transfer defects caused by gas are generated. Therefore, a metal plate having gas permeability was prepared with a 3D printer, and the surface and internal structure of the metal plate was evaluated. Further, the porosity of the metal plate was calculated by measuring the size and weight of the produced metal plate. As a result, it was confirmed that there were numerous holes in the inside of the metallic material, and it was confirmed that the hole having the role of permeating the gas and the hole having the role of temporarily preserving the gas. Furthermore, it was also confirmed that the porosity of the metal plate is about 10%. Metallic materials with gas permeability can be expected to be materials required for MEMS device processing.
机译:MEMS技术被纳入各种设备(汽车,数码相机,光学器件),对于我们的日常生活是必不可少的。半导体制造工艺技术,如光刻法和离子束法,主要用于MEMS和微生物的微型切换方法。在光刻法中,产生由气体引起的许多转移缺陷。因此,用3D打印机制备具有透气性的金属板,并评估金属板的表面和内部结构。此外,通过测量所生产的金属板的尺寸和重量来计算金属板的孔隙率。结果,确认金属材料内部存在许多孔,并且证实具有渗透气体的作用的孔和具有临时保留气体的作用的孔。此外,还证实金属板的孔隙率为约10%。具有透气性的金属材料可以预期是MEMS器件处理所需的材料。

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