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Internal structure of metal material with gas permeability function related to MEMS devices

机译:具有透气性的金属材料的内部结构与MEMS装置有关

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MEMS technology is incorporated into various devices (automobiles, digital cameras, optical devices) indispensable for our daily lives. Semiconductor manufacturing process technology such as photolithography method and ion beam method is mainly used for micropatterning necessary for MEMS and microfabrication of diffraction grating. In photolithography, many transfer defects caused by gas are generated. Therefore, a metal plate having gas permeability was prepared with a 3D printer, and the surface and internal structure of the metal plate was evaluated. Further, the porosity of the metal plate was calculated by measuring the size and weight of the produced metal plate. As a result, it was confirmed that there were numerous holes in the inside of the metallic material, and it was confirmed that the hole having the role of permeating the gas and the hole having the role of temporarily preserving the gas. Furthermore, it was also confirmed that the porosity of the metal plate is about 10%. Metallic materials with gas permeability can be expected to be materials required for MEMS device processing.
机译:MEMS技术已集成到我们日常生活中必不可少的各种设备(汽车,数码相机,光学设备)中。诸如光刻法和离子束法之类的半导体制造工艺技术主要用于MEMS所需的微图案化和衍射光栅的微制造。在光刻中,会产生许多由气体引起的转印缺陷。因此,用3D打印机制备了具有透气性的金属板,并评价了该金属板的表面和内部结构。此外,通过测量所生产的金属板的尺寸和重量来计算金属板的孔隙率。结果,确认在金属材料的内部存在许多孔,并且确认了该孔具有渗透气体的作用和该孔具有暂时保留气体的作用。此外,还证实了金属板的孔隙率约为10%。具有透气性的金属材料有望成为MEMS器件加工所需的材料。

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