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Stress analysis on the reinforcement particles of the metal matrix composite by Raman spectroscopy

机译:拉曼光谱法对金属基质复合材料加固颗粒的应力分析

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In this research, the stress state of the reinforcing SiC particles in a hybrid MMC is investigated by micro Raman spectroscopy. The experiment was carried out in situ in the Raman spectroscopy. Experimental results show that cracks due to monotonic loading propagates by the debonding of the particle/matrix interface and particle fracture. Moreover, secondary cracks form in front of the main crack tip coalesce with the main crack in subsequent loading and final failure occurs. A high decrease in stress (several hundred in MPa) is observed with the interfacial debonding at the interface and with the particle fracture on the particle. The critical tensile stresses for particle-matrix interface debonding and particle fracture develop in hybrid MMC are also estimated during the crack propagation.
机译:在该研究中,通过微拉曼光谱研究了杂交MMC中增强SiC颗粒的应力状态。实验原位在拉曼光谱中进行。实验结果表明,由单调载荷引起的裂缝通过颗粒/基质界面和颗粒骨折的剥离而传播。此外,在主要裂纹尖端的前部次裂缝形成,随后加载和最终失败发生主要裂缝。在界面处的界面脱焊剂和颗粒上的颗粒断裂,观察到应力(在MPa中的几百个MPa)降低。在裂纹繁殖期间还估计了杂交MMC中粒子基质界面剥离和颗粒断裂发育的临界拉伸应力。

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