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Silicon-based Ge_(0.89)Sn_(0.11) photodetector and light emitter towards mid-infrared applications

机译:基于硅基GE_(0.89)SN_(0.11)光电探测器和光发射器朝向中红外应用

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The GeSn alloy with Sn composition of 11% has been grown using an industry standard reduced-pressure chemical vapor deposition reactor in a single run epitaxy. Low-cost commercially available GeH_4 and SnCl_4 were used as Ge and Sn precursors, respectively. The material characterization showed that the threading dislocations were trapped in the Ge/GeSn interface and do not propagate to the GeSn layer, resulting in high quality material. The temperature-dependent photoluminescence study revealed that the direct bandgap GeSn alloy was achieved, as the emission intensity significantly increased at low temperature. The sample was than fabricated into photoconductive detectors and waveguide lasers. For the photodetector, the spectral response wavelength cutoff at 3.0 μm was observed. The specific detectivity of 3.5 × 10~(10) cm ?Hz~(1/2)W~(-1) was achieved, which is close to that of market dominating InGaAs photodetectors that are operating in the same wavelength range; For the waveguide laser, the lasing threshold pumping power density of 86.5 kW/cm~2 at 10 K and the highest operating temperature of 110 K were obtained. Furthermore, the characteristic temperature was evaluated as 65 K.
机译:使用单次运行外延的工业标准减压化学气相沉积反应器生长11%的GESN合金11%。低成本市售GEH_4和SNCL_4分别用作GE和Sn前体。材料表征显示,螺纹脱位被捕获在GE / GESN界面中,并且不会传播到GESN层,从而产生高质量的材料。温度依赖性光致发光研究表明,由于在低温下发射强度显着增加,因此实现了直接带隙GESN合金。样品比制造成光电导探测器和波导激光器。对于光电探测器,观察到3.0μm的光谱响应波长截止。实现了3.5×10〜(10)厘米的特定检测率为Hz〜(1/2)W〜(-1),这与在相同波长范围内运行的InGaAS光电探测器的市场接近市场;对于波导激光器,获得10 k处86.5 kW / cm〜2的激光阈值泵送功率密度和110k的最高工作温度。此外,特征温度评价为65 K.

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