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Performance of InGaAs/InP planar infrared detector with different passivation films

机译:不同钝化膜的InGaAs / InP平面红外探测器的性能

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In order to study the effect of different passivation films on the detector performance, the front-illuminated planar-type 256×1 element InGaAs/InP detectors were fabricated with SiN_x film and SiO_2 film. The SiN_x film was deposited by plasma enhanced chemical vapor deposition (PECVD) and SiO_2 film was deposited by magnetron sputtering technology. The electrical properties and photoresponse characteristics were investigated after the detector mounted on dewar. The photoresponse maps from laser beam induced current (LBIC) method show that the isolation of adjacent elements of the detector with SiN_x film is better than the detector with SiO_2 film. Furthermore, at room temperature the average density of dark current and the average peak detectivity of the two kinds of detector is 26.8 nA/cm~2 and 41.2 nA/cm~2 at 100 mV reverse bias, 1.21×10~(12) cm·Hz~(1/2)/W and 1.08×10~(12) cm·Hz~(1/2)/W respectively. Therefore, the detector with SiN_x film deposited by PECVD could availably passivate the surface in comparison with the detector with SiO_2 film by magnetron sputtering technology.
机译:为了研究不同钝化膜对探测器性能的影响,用SIN_X膜和SiO_2膜制造了前照射的平面型256×1元件IngaAs / InP探测器。通过等离子体增强的化学气相沉积(PECVD)沉积SIN_X薄膜,并通过磁控溅射技术沉积SiO_2薄膜。在安装在杜瓦尔的探测器之后研究了电性能和光响应特性。来自激光束感应电流(LBIC)方法的光响应映射表明,使用SIN_X膜的检测器的相邻元件的隔离优于带SiO_2膜的检测器。此外,在室温下,暗电流的平均密度和两种检测器的平均峰值检测率为26.8纳/ cm〜2和41.2 Na / cm〜2,在100mV反向偏压下,1.21×10〜(12)厘米·Hz〜(1/2)/ W和1.08×10〜(12)cm·Hz〜(1/2)/ w。因此,与PECVD沉积的SIN_X薄膜的检测器可以通过磁控溅射技术与具有SiO_2膜的检测器相比,表面可用地钝化表面。

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