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Leakage Power Improvement in SRAM Cell with Clamping Diode Using Reverse Body Bias Technique

机译:使用反向体偏置技术漏电二极管的SRAM电池漏功率改进

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Leakage has been the main issue in SRAM design due to the scaling of CMOS devices. In this paper, a novel technique has been proposed for 8T SRAM to reduce leakage current at 45-nm technology node. Here, we have used three different reverse body biasing techniques to reduce the leakage power. The three techniques used are: clamping of NMOS diode, clamping of PMOS diode, and clamping of NMOS and PMOS diode. Out of the three techniques, leakage current in 8T SRAM was minimum using PMOS clamping diode as compared to other proposed techniques. The supply voltage has been varied from 0.5 to 0.85 V. The leakage current has been reduced by both NMOS and PMOS clamping techniques, but the results for PMOS and NMOS were high as compared to two but lower than that of SRAM cell. The leakage current improved by 3.3x using PMOS technique and 2.7x using NMOS technique at supply voltage of 0.5V. The static power has also been calculated and compared for the three techniques.
机译:由于CMOS器件的缩放,泄漏是SRAM设计中的主要问题。本文已提出了一种新的8T SRAM技术,以减少45-NM技术节点的漏电流。在这里,我们使用了三种不同的反向体偏置技术来减少泄漏功率。使用的三种技术是:NMOS二极管的钳位,PMOS二极管的钳位,以及NMOS和PMOS二极管的钳位。除了三种技术中,与其他所提出的技术相比,使用PMOS钳位二极管的8T SRAM中的漏电流最小。电源电压从0.5至0.85V变化。通过NMOS和PMOS夹紧技术已经减少了漏电流,但PMOS和NMOS的结果与两次但低于SRAM细胞的结果相比。使用PMOS技术在0.5V的电源电压下使用NMOS技术的PMOS技术和2.7倍提高了3.3x的漏电流。还计算了静态功率,并比较了三种技术。

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