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Characterization of Tin Oxide Doping Antimony Thin Layer With Sol-Gel Spin Coating Method for Electronic Device

机译:用溶胶 - 凝胶旋转涂布法的氧化锡掺杂锑薄层对电子装置的表征

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Antimony tin oxide coating research has been carried out using a spin sol gel coating method with different doping concentrations of 0, 5, 10, 15, 20 %. The results of the study on the morphological structure (SEM) of thin films that have been carried out showed more cracks on the surface of the morphology of thin layers without doping compared to thin layers with doping antimony. The Results of crystal structure of XRD in thin antimony doping tin oxide layer shows the grinding index of tin oxide crystals, 101, 110, 211, 220. In grain size, with increasing antimony doping percentage, the average grain size decreases. The optical properties using UV-Vis in thin films of antimony tin oxide doping show samples including semiconductor materials that can be used as electronic devices as seen from the reduction of this energy gap from 3.680 to 3.574 eV. Also seen is an increase in the percentage of antimony doping and repetition of layers, the lower the transmissions value, but the value of absorbance of the thin layer increases.
机译:使用纺丝溶胶凝胶涂布方法进行锑锡氧化钛涂层研究,该方法具有不同掺杂浓度为0,5,10,15,20%。已经进行的薄膜的形态结构(SEM)的研究结果显示出在没有掺杂的薄层的形态表面上显示出更多的裂缝,而与具有掺杂锑的薄层相比。薄锑掺杂氧化锡层中XRD晶体结构的结果显示,氧化锡晶体,101,110,211,220的研磨指数。在晶粒尺寸下,随着锑掺杂百分比,平均晶粒尺寸降低。在锑锡氧化物掺杂薄膜中使用UV-Vis的光学性能显示样品,该样品包括可用作从3.680到3.574 EV的减少这种能隙所看到的电子设备的半导体材料。还看到的是锑掺杂和重复的百分比增加,变速值越低,但薄层的吸光度值增加。

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