An In-situ Method for Comparing Thermal Conductivity of Insulation Film in MEMS

摘要

A effective method for comparing the thermal conductivity of insulation film was developed here. The thermal simulation on Ansys software indicated that different materials at same thickness exhibit different temperature distribution in this system. Base on this, the new measurement structure was fabricated by MEMS process. The results by Infrared Imager exhibited similar trends with the simulation. So the AlN/Polyimide nanocomposites film at different AlN content are compared based on this. The result shows that the AlN/PI at content(40%) has the high thermal conductivity. What's more, this method can effectively and conveniently In-situ compare the thermal conductivity of insulation film in MEMS.