Numerical Simulation and Characteristics Test of Temperature Field under Short-circuit Fault

摘要

In this article, finite element software ANSYS was used to simulate the temperature field of short-circuit fault on copper conducting wire. A third-dimensional thermoelectric coupling model was established after analyzing the principle of short-circuit fault. The problem of latent heat was solved by the enthalpy method. The paper simulated the changes of temperature field, so as to get vaporization volume of copper wires and calculate the splash of energy during transient short circuit, which are the most elements affecting on the splashing energy.