Design of multifunctional composites and their use for the 3-D printing of microsystems

摘要

Many of today's high-tech products are approaching their technological limits. For example, the microelectronics community is faced with overheating devices with a demand for compact three-dimensional (3D) architectures and lower power consumption, whereas the aerospace industry is seeking lighter, stiffer and more electrically conductive materials for the creation of more energy efficient aircraft. A promising solution is to capitalize on the amazing electrical, thermal and mechanical properties of some nanoscopic materials (one billionth of a meter). However, several challenges in material processing and manufacturing must be resolved, namely exploiting these properties at the industrial scale and overcoming the current planar configuration with a truly 3D method.